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Tel: 0551-63484895

After Sales: 4006082908

Headquarters address: No. 4708 Yungu Road, Economic and Technological Development Zone, Hefei City, Anhui Province, China

Produce address: Zhenping Technology Industrial Park, No. 4345 Tiandu Road, Hefei Economic and Technological Development Zone, Anhui Province, China

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Water-cooled oxygen-free oven

Usage introduction: Mainly used for precision baking, drying, shaping and processing of molded solid baking, IC (DB/WB), FPD, high-precision electronic components, electronic ceramic materials, electrical products, materials, spare parts, etc.

Keywords: Semiconductor specific equipment

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Description

Usage introduction: Mainly used for precision baking, drying, shaping and processing of molded solid baking, IC (DB/WB), FPD, high-precision electronic components, electronic ceramic materials, electrical products, materials, spare parts, etc.

circulatory system

Hot air circulation system

Performance parameters

temperature range

RT.+25℃-250℃

temperature fluctuation range

±1%℃ (empty box test)

temperature uniformity

±2%℃ (empty box test)

Heating time

<30Min(175℃)&<40Min(200℃)

Oven structure

Inside and outside cavity of oven

SUS304 mirror stainless steel, painted board, resin board

Insulation Materials

High density ceramic fiber cotton

heating

Dust-free heating wire or stainless steel heating tube

cooling method

Water cooling, air cooling, multi-section cooling

model

MOLJM series

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