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Ammonia reverse furnace

It is mainly used in compound semiconductors and metal electrodes. The interconnecting line uses metal stripping processes to make the photoresist with an inverted trapezoidal shape.

Keywords: Semiconductor specific equipment

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Description

Application introduction:

It is mainly used in compound semiconductors and metal electrodes. The interconnecting line uses metal stripping processes to make the photoresist with an inverted trapezoidal shape. Normally adopt negative glue technology. Due to the difficulty of negative glue, it has certain technological difficulties and local defects. For example, the resolution is not high. , The width is not good, and the hill -shaped angle is unstable and other factors. Most of the ammonia condition reversal process is used in the industry, and the positive glue of the phenolic resin base is used. After the exposure of the positive glue is exposed, the carboxylic acid, ammonia gas neutral and acid, and then a full exposure. At the same time, the resolution and line width stability of the positive glue is retained.

Vacuum

150Pa; Vacuum pump;

Heating method

Heating around the outside of the cavity;

Temperature

RT+10 ℃ ~ 200 ℃; micro -computer temperature controller, accurate and reliable temperature control;

Temperature control accuracy

±2%℃(within 150 ℃);

Ammonia reverse process

The heating reaches the set value-drawing vacuum-reaches the set value-ammonia gas-product-take-off exposure machine reverse exposure.

Main feature

The box door is closed to adjust tightly, and the overall shaped silicone rubber door sealing circle to ensure the high vacuum in the box. The studio is made of stainless steel plates, electrolytic polishing to ensure that the product is durable.

 

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